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  Application Notes: Rönt...  
Eine Legierungsanalyse mit dem XAN 500 zeigte, dass das Pult aus Tombak bestand, einem hochwertigen Messing mit hohem Kupferanteil. Für alle Teile des Pults ergaben sich vergleichbare Konzentrationen von Kupfer, Zink und Blei – ein starkes Indiz dafür, dass es sich um ein Original handelt.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
  Application Notes: Mate...  
Um den Verbraucher zu schützen, gibt es Richtlinien, die den Gehalt von Blei (Pb), Kadmium (Cd), etc. in Modeschmuckartikeln, Uhrenteilen und in metallischen Teilen an Handtaschen, Portemonnaies oder an Kleidungsstücken reglementieren.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
  Application Notes: Gold...  
Um den Verbraucher zu schützen, gibt es Richtlinien, die den Gehalt von Blei (Pb), Kadmium (Cd), etc. in Modeschmuckartikeln, Uhrenteilen und in metallischen Teilen an Handtaschen, Portemonnaies oder an Kleidungsstücken reglementieren.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
  Application Notes: Blei...  
Um nachzuweisen, dass hi-rel Produkte den Vorgaben entsprechend gefertigt wurden, muss der Bleigehalt im Lot überprüft werden. Die Röntgenfluoreszenz-Analyse ist eine zuverlässige und zerstörungsfreie Prüfmethode, um sicherzustellen, dass mind.
To prove that hi-rel products have been manufactured correctly, the lead content in the solder needs to be controlled and verified. A quick, reliable and non-destructive test to ensure it contains at least 3% lead or other alloying elements can be accomplished using the X-ray fluorescence method.
  Application Notes: Mate...  
Die steigenden Beschränkungen für den Einsatz von Blei in Elektronik-Produkten zwingen zur Suche nach geeignetem Ersatz. Für Kontaktierungen in modernen IC-Gehäusen werden die ehemals allgegenwärtigen, qualitativ hochwertigen aber leider schädlichen SnPb-Lote (solder bumps) heute durch bleifreie Technologien wie SnAgCu-Legierungen ersetzt.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
  Application Notes: Elek...  
Aufgrund des Verbotes von Blei und anderen Schwermetallen durch die EU-Richtlinien EU2002/95/EC und EU2002/96/EC müssen auf Leiterplatten lötbare, jedoch bleifreie Schichtsysteme eingesetzt werden. Bleifreies, chemisch abgeschiedenes Zinn birgt die Gefahr, dass durch Diffusionsprozesse die Restdicke der nutzbaren Reinzinnschicht so gering wird, dass die Qualität von Lötprozessen und Lötverbindungen beeinträchtigt werden kann.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
  Application Notes: Elek...  
Die steigenden Beschränkungen für den Einsatz von Blei in Elektronik-Produkten zwingen zur Suche nach geeignetem Ersatz. Für Kontaktierungen in modernen IC-Gehäusen werden die ehemals allgegenwärtigen, qualitativ hochwertigen aber leider schädlichen SnPb-Lote (solder bumps) heute durch bleifreie Technologien wie SnAgCu-Legierungen ersetzt.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
  Application Notes: Kont...  
Aufgrund des Verbotes von Blei und anderen Schwermetallen durch die EU-Richtlinien EU2002/95/EC und EU2002/96/EC müssen auf Leiterplatten lötbare, jedoch bleifreie Schichtsysteme eingesetzt werden. Bleifreies, chemisch abgeschiedenes Zinn birgt die Gefahr, dass durch Diffusionsprozesse die Restdicke der nutzbaren Reinzinnschicht so gering wird, dass die Qualität von Lötprozessen und Lötverbindungen beeinträchtigt werden kann.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
  Industrielle Messtechni...  
Um nachzuweisen, dass hi-rel Produkte den Vorgaben entsprechend gefertigt wurden, muss der Bleigehalt im Lot überprüft werden. Die Röntgenfluoreszenz-Analyse ist eine zuverlässige und zerstörungsfreie Prüfmethode, um sicherzustellen, dass mind.
To prove that hi-rel products have been manufactured correctly, the lead content in the solder needs to be controlled and verified. A quick, reliable and non-destructive test to ensure it contains at least 3% lead or other alloying elements can be accomplished using the X-ray fluorescence method.
To prove that hi-rel products have been manufactured correctly, the lead content in the solder needs to be controlled and verified. A quick, reliable and non-destructive test to ensure it contains at least 3% lead or other alloying elements can be accomplished using the X-ray fluorescence method.
To prove that hi-rel products have been manufactured correctly, the lead content in the solder needs to be controlled and verified. A quick, reliable and non-destructive test to ensure it contains at least 3% lead or other alloying elements can be accomplished using the X-ray fluorescence method.
To prove that hi-rel products have been manufactured correctly, the lead content in the solder needs to be controlled and verified. A quick, reliable and non-destructive test to ensure it contains at least 3% lead or other alloying elements can be accomplished using the X-ray fluorescence method.
  Lösungen: RoHS/Spuren- ...  
Um den Verbraucher zu schützen, gibt es Richtlinien, die den Gehalt von Blei (Pb), Kadmium (Cd), etc. in Modeschmuckartikeln, Uhrenteilen und in metallischen Teilen an Handtaschen, Portemonnaies oder an Kleidungsstücken reglementieren.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
  Industrielle Messtechni...  
Gemäß der RoHS-Restriktion dürfen Grenzwerte von 1000 ppm für Blei (Pb), Quecksilber (Hg), hexavalentem Chrom (Cr VI) und Brom-Verbindungen (PBB, PBDE) nicht überschritten werden, während bei Kadmium (Cd) die Grenze bei 100 ppm liegt.
It is critical for manufacturers and distributors of many products to be able to detect harmful substances. Various regulations, such as RoHS (Restriction of Hazardous Substances), DIN EN 71 (Safety of Toys Standard) and CPSIA (Consumer Product Safety Improvement Act), specify maximum permissible values, particularly for heavy metals.
It is critical for manufacturers and distributors of many products to be able to detect harmful substances. Various regulations, such as RoHS (Restriction of Hazardous Substances), DIN EN 71 (Safety of Toys Standard) and CPSIA (Consumer Product Safety Improvement Act), specify maximum permissible values, particularly for heavy metals.
It is critical for manufacturers and distributors of many products to be able to detect harmful substances. Various regulations, such as RoHS (Restriction of Hazardous Substances), DIN EN 71 (Safety of Toys Standard) and CPSIA (Consumer Product Safety Improvement Act), specify maximum permissible values, particularly for heavy metals.
It is critical for manufacturers and distributors of many products to be able to detect harmful substances. Various regulations, such as RoHS (Restriction of Hazardous Substances), DIN EN 71 (Safety of Toys Standard) and CPSIA (Consumer Product Safety Improvement Act), specify maximum permissible values, particularly for heavy metals.
It is critical for manufacturers and distributors of many products to be able to detect harmful substances. Various regulations, such as RoHS (Restriction of Hazardous Substances), DIN EN 71 (Safety of Toys Standard) and CPSIA (Consumer Product Safety Improvement Act), specify maximum permissible values, particularly for heavy metals.
  Lösungen: Bauelemente |...  
Aufgrund des Verbotes von Blei und anderen Schwermetallen durch die EU-Richtlinien EU2002/95/EC und EU2002/96/EC müssen auf Leiterplatten lötbare, jedoch bleifreie Schichtsysteme eingesetzt werden. Bleifreies, chemisch abgeschiedenes Zinn birgt die Gefahr, dass durch Diffusionsprozesse die Restdicke der nutzbaren Reinzinnschicht so gering wird, dass die Qualität von Lötprozessen und Lötverbindungen beeinträchtigt werden kann.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
  Industrielle Messtechni...  
Eine Legierungsanalyse mit dem XAN 500 zeigte, dass das Pult aus Tombak bestand, einem hochwertigen Messing mit hohem Kupferanteil. Für alle Teile des Pults ergaben sich vergleichbare Konzentrationen von Kupfer, Zink und Blei – ein starkes Indiz dafür, dass es sich um ein Original handelt.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
Alloy analysis with the XAN 500 showed that the piece was made of tombak, a high-quality brass with a high copper content. All parts showed comparable concentrations of copper, zinc and lead – a strong indication that all pars were original. In addition, traces of nickel, tin, iron and antimony were found in the alloy.
  Lösungen: Bauelemente |...  
Die steigenden Beschränkungen für den Einsatz von Blei in Elektronik-Produkten zwingen zur Suche nach geeignetem Ersatz. Für Kontaktierungen in modernen IC-Gehäusen werden die ehemals allgegenwärtigen, qualitativ hochwertigen aber leider schädlichen SnPb-Lote (solder bumps) heute durch bleifreie Technologien wie SnAgCu-Legierungen ersetzt.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
  Industrielle Messtechni...  
Die steigenden Beschränkungen für den Einsatz von Blei in Elektronik-Produkten zwingen zur Suche nach geeignetem Ersatz. Für Kontaktierungen in modernen IC-Gehäusen werden die ehemals allgegenwärtigen, qualitativ hochwertigen aber leider schädlichen SnPb-Lote (solder bumps) heute durch bleifreie Technologien wie SnAgCu-Legierungen ersetzt.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
  Industrielle Messtechni...  
Um den Verbraucher zu schützen, gibt es Richtlinien, die den Gehalt von Blei (Pb), Kadmium (Cd), etc. in Modeschmuckartikeln, Uhrenteilen und in metallischen Teilen an Handtaschen, Portemonnaies oder an Kleidungsstücken reglementieren.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
Because articles that come in contact with human skin should be free of harmful materials and allergenic substances, new regulations for consumer protection are in the works to restrict the content of lead (Pb), cadmium (Cd) and other toxic or allergenic elements in fashion jewelery, watch parts, and accessories, as well as in the metal fastenings and ornaments on handbags, wallets or clothing. This analytical challenge requires measuring equipment that can quickly and easily detect even the tiniest amounts of these substances.
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Aufgrund des Verbotes von Blei und anderen Schwermetallen durch die EU-Richtlinien EU2002/95/EC und EU2002/96/EC müssen auf Leiterplatten lötbare, jedoch bleifreie Schichtsysteme eingesetzt werden. Bleifreies, chemisch abgeschiedenes Zinn birgt die Gefahr, dass durch Diffusionsprozesse die Restdicke der nutzbaren Reinzinnschicht so gering wird, dass die Qualität von Lötprozessen und Lötverbindungen beeinträchtigt werden kann.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.
Because EU directives like EU2002/95/EC and EU2002/96/EC prohibit lead and other heavy metals, the solderable coating systems used on printed circuit boards must now be lead free. However, immersion tin carries the risk that, due to diffusion processes, the usable tin remaining in the plating can be insufficient to guarantee the success of solder processes and the quality of solder joints. Therefore the thickness of the pure tin in the coating must be checked before soldering.