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Für Kontaktierungen in modernen IC-Gehäusen werden die ehemals allgegenwärtigen, qualitativ hochwertigen aber leider schädlichen SnPb-Lote (solder bumps) heute durch bleifreie Technologien wie SnAgCu-Legierungen ersetzt.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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Due to growing restrictions on the use of lead in electronic products, efforts have been made to find appropriate substitutes. In the advanced IC packaging industry, the formerly ubiquitous, high-quality – but hazardous – eutectic SnPb solder bumps are now gradually being replaced by lead-free technology, such as SnAgCu alloy solder bumps. Because these new alloys require a certain composition in order to assure solderability and other mechanical properties, they must be measured precisely.
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