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Zum Beispiel verhalten sich Lotkugeln (engl. solder bumps) mit einem Ag-Gehalt über 3% stabiler gegenüber thermischer Ermüdung und sind widerstandsfähiger gegen Scherkräfte, während Legierungen mit niedrigerem Ag-Gehalt (ca. 1%) eine sehr gute Plastizität zeigen – und damit bessere Dauerfestigkeit unter Zugbeanspruchung. Zudem senken schon 0,5% Cu im Lot die Lösung von Kupfer aus dem Grundmaterial, was eine Verbesserung der Lötfähigkeit zur Folge hat.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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It is well known that the Ag and Cu content can exert profound impacts on the solderability and mechanical properties of Sn-based solder bumps. For instance, solder bumps with Ag content of more than 3% perform better in thermal fatigue testing and are more resistant to shear plastic deformation, while alloys with lower Ag content (around 1%) exhibit superior ductility and therefore better fatigue endurance under severe strain conditions. Furthermore, a mere 0.5% of Cu can decrease the dissolution behaviour of substrate Cu, thus increasing solderability.
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