verwindung – -Translation – Keybot Dictionary

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Unter anderem getrieben von der raschen Entwicklung im Bereich Wearables werden Fertigungsprozesse für flexible Trägermaterialien immer wichtiger. Dr. Hans Bell, Rehm Thermal Systems, behandelte daher in seinem Vortrag die Herausforderungen der Verwindung und Verwölbung von Leiterplatten und anderen Trägermaterialien während des Lötprozesses.
The seminar clearly showed that intelligent production processes and the digital networking of manufacturing equipment are key to the success of Industry 4.0. In this respect, the introduction of a new standard for interface communication “The Hermes Standard” is a big step in the right direction. The Hermes standard offers an overreaching protocol, irrespective of manufacturer, for machine-to-machine communication (M2M) in module manufacturing. The objective is to improve the board-flow-management and the traceability across all stations of an SMT line. This uses modern communication technology and standardised data formats for M2M communication. The Hermes standard is officially recognised as a next-generation technology and follows the IPC-SMEMA-9851 standard. Rehm plays a key role in the development of this standard, helping to make system networking within SMT manufacturing easier, quicker and more efficient in the future. The Rehm Reflow soldering system can already be equipped with a Hermes interface. The new, clearly structured interface design and the intuitive touch control of the ViCON system software also contribute with numerous features such as the monitoring tools from the ViCON Analytics range, the ViCON Connect remote manager for monitoring the entire Rehm machinery and the ViCON app, which allows the operator to keep an eye on production at all times, directly contributing to the networking of production processes with respect to Industry 4.0.
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Durch die geringen Auslauftemperaturen kann somit auf eine zusätzliche Kühlung, wie z.B. ein Auslaufband mit Lüftern, verzichtet werden. Vor allem Baugruppen mit inhomogener Verteilung der Kupfer-Lagen werden mit der Unterseitenkühlung sicher vor Verwindung und Verwölbung bewahrt.
In order to cool complex modules, an adjustable cooling system is required, which meets the demands of these electronic components. As well as our tried-and-tested cooling tract, we can also extend the cooling zones using a power cooling unit. As part of this process, cold air is fed onto the board from above, where it can be cooled in a more intensive, gentle manner as a result of the process being extended. The power cooling unit can be implemented in the form of an extension to the standard cooling zones under nitrogen atmosphere and is also available as a separate, downstream module for increased cooling capacity for insensitive materials under normal atmospheric conditions.