solde – English Translation – Keybot Dictionary

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  www.rifugiotorredipisa.it  
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Oui les chèques vacances sont acceptés pour le solde du séjour.
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Yes, ‘chèques vacances’ are accepted to pay the balance of the stay.
  yellow.local.ch  
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img5 Bilder descrLa laiterie a été construite en 1925 et réceptionne actuellement 3 millions de kg de lait par année. Une partie est transformée sur place. Le solde...
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img5 images descrLa laiterie a été construite en 1925 et réceptionne actuellement 3 millions de kg de lait par année. Une partie est transformée sur place. Le solde...
  2 Hits www.mcm.public.lu  
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Es ist verboten, außerhalb der vom Gesetz vorgesehenen Fälle und Bedingungen einen Verkauf  mittels der Bezeichnung  „solde (s)“ (Schlussverkauf), allein oder zusammen mit anderen Wörtern, anzukündigen oder durchzuführen, sowie mittels jeder Bezeichnung oder Aufmachung, die den Eindruck eines Schlussverkaufs erweckt.
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It is prohibited to announce or to proceed with holding a sale by either using in isolation the term “ bargain sale(s) “, or in conjunction with other terms, as well as any denomination or presentation which suggests a bargain sale outside of the cases and conditions provided by law, i.e.
  4 Hits www.wu.ac.at  
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In the process of constant impro­ve­ment of the perfor­mance of the tracking system at the Large Hadron Collider (LHC), CERN deve­l­oped a new tech­no­logy denoted as Direct Laser Solde­ring (DLS), which consti­tutes a novel inter­con­nec­tion tech­no­logy to connect silicon chips to flexible printed circuits (FPC).
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This pro­ject was part of the In­sti­tute for En­tre­pren­eur­ship and In­nov­a­tion’s sem­inar course “New Busi­ness Devel­op­ment”. The cli­ent was CERN (Con­seil Européen pour la Recher­che Nucléaire), the European Or­gan­iz­a­tion for Nuc­lear Re­search with headquar­ters in Geneve. In the pro­cess of con­stant im­prove­ment of the per­form­ance of the track­ing sys­tem at the Large Had­ron Col­lider (LHC), CERN developed a new tech­no­logy de­noted as Dir­ect Laser Sol­der­ing (DLS), which con­sti­tutes a novel in­ter­con­nec­tion tech­no­logy to con­nect sil­icon chips to flex­ible prin­ted cir­cuits (FPC). The new Dir­ect Laser Sol­der­ing tech­no­logy con­tains a num­ber of sig­ni­fic­ant be­ne­fits in com­par­ison to con­ven­tional chip bond­ing pro­cesses which have the po­ten­tial to re­vo­lu­tion­ize the state-of-the-art pro­cesses of today.