temperatur – Übersetzung – Keybot-Wörterbuch

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  Lösungen: Oberflächenpr...  
Das heiße Rauchgas erhitzt Wasser in einem Boiler. So kann, je nach Temperatur, entweder heißes Wasser für andere industrielle Zwecke gewonnen werden oder Wasserdampf, das eine Turbine zur Stromerzeugung antreibt.
Energy that would otherwise be lost in discharged exhaust is captured and reclaimed in waste heat recovery boilers. The hot flue gas is fed into the boiler where it heats up water flowing through pipes within the housing, producing either hot water for use in other industrial purposes or, depending on the temperatures involved, steam that powers a gas turbine to generate electricity.
  Application Notes: Dick...  
Das heiße Rauchgas erhitzt Wasser in einem Boiler. So kann, je nach Temperatur, entweder heißes Wasser für andere industrielle Zwecke gewonnen werden oder Wasserdampf, das eine Turbine zur Stromerzeugung antreibt.
Known for their resistance to oxidation and corrosion, Inconel alloys are often used in extreme environments subject to high heat and pressure. This is why Inconel coatings are often used in waste heat recovery boilers, which recycle the energy contained in hot exhausts given off by various manufacturing processes. However, to assure the functionality of the coating, a minimum thickness must be guaranteed, and thus, measured precisely.
  Lösungen: Oberflächenpr...  
Die Qualität der Verdichtung ist von verschiedenen Faktoren wie der Güte der Oxidschicht, der Verdichtungszeit, Temperatur des Verdichtungsbades, pH-Wert der Verdichtungslösung etc. abhängig und kann mit Hilfe des Scheinleitwerts zerstörungsfrei überprüft werden.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
  Application Notes: Best...  
Auch das Unterschreiten der MS-Temperatur (martensite start) ist kritisch. Bei langsamer Abkühlung wandelt sich Austenit in eine Mischung aus Ferrit und Zementit um. Kühlt man Auste­nit jedoch sehr schnell ab ("Abschrecken" des Stahls, um diesen zu härten), so kann sich kein Ferrit bzw. Ze­mentit bilden, da es gar nicht erst zu einer entsprechen­den Diffusion des Kohlenstoffs kommt.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
  Application Notes: Witt...  
Die Qualität der Verdichtung ist von verschiedenen Faktoren wie der Güte der Oxidschicht, der Verdichtungszeit, Temperatur des Verdichtungsbades, pH-Wert der Verdichtungslösung etc. abhängig und kann mit Hilfe des Scheinleitwerts zerstörungsfrei überprüft werden.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
  Application Notes: Kont...  
Sofort nach dem Abscheiden der Zinnschicht setzt die Diffusion des Kupfers in die Zinnschicht ein. Es bilden sich Zonen aus intermetallischen Verbindungen, die auf Kosten der restlichen Zinnmenge in Abhängigkeit von Temperatur und Zeit wachsen.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
  Industrielle Messtechni...  
Das heiße Rauchgas erhitzt Wasser in einem Boiler. So kann, je nach Temperatur, entweder heißes Wasser für andere industrielle Zwecke gewonnen werden oder Wasserdampf, das eine Turbine zur Stromerzeugung antreibt.
Energy that would otherwise be lost in discharged exhaust is captured and reclaimed in waste heat recovery boilers. The hot flue gas is fed into the boiler where it heats up water flowing through pipes within the housing, producing either hot water for use in other industrial purposes or, depending on the temperatures involved, steam that powers a gas turbine to generate electricity.
Energy that would otherwise be lost in discharged exhaust is captured and reclaimed in waste heat recovery boilers. The hot flue gas is fed into the boiler where it heats up water flowing through pipes within the housing, producing either hot water for use in other industrial purposes or, depending on the temperatures involved, steam that powers a gas turbine to generate electricity.
Energy that would otherwise be lost in discharged exhaust is captured and reclaimed in waste heat recovery boilers. The hot flue gas is fed into the boiler where it heats up water flowing through pipes within the housing, producing either hot water for use in other industrial purposes or, depending on the temperatures involved, steam that powers a gas turbine to generate electricity.
Energy that would otherwise be lost in discharged exhaust is captured and reclaimed in waste heat recovery boilers. The hot flue gas is fed into the boiler where it heats up water flowing through pipes within the housing, producing either hot water for use in other industrial purposes or, depending on the temperatures involved, steam that powers a gas turbine to generate electricity.
  Lösungen: Bauelemente |...  
Sofort nach dem Abscheiden der Zinnschicht setzt die Diffusion des Kupfers in die Zinnschicht ein. Es bilden sich Zonen aus intermetallischen Verbindungen, die auf Kosten der restlichen Zinnmenge in Abhängigkeit von Temperatur und Zeit wachsen.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
  Industrielle Messtechni...  
Auch das Unterschreiten der MS-Temperatur (martensite start) ist kritisch. Bei langsamer Abkühlung wandelt sich Austenit in eine Mischung aus Ferrit und Zementit um. Kühlt man Auste­nit jedoch sehr schnell ab ("Abschrecken" des Stahls, um diesen zu härten), so kann sich kein Ferrit bzw. Ze­mentit bilden, da es gar nicht erst zu einer entsprechen­den Diffusion des Kohlenstoffs kommt.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
Also dropping below the MS (martensite start) temperature can be problematic. When allowed to cool slowly, the austenite transforms into a mixture of ferrite and cementite. But in a rapid cooling process (i.e. quenching, employed to harden the steel), there is no time for the carbon atoms to diffuse out of the crystalline structure in large enough quantities to form ferrite and cementite, resulting in martensite.
  Lösungen: Lackschichten...  
Autolack schützt Karrosserien von Fahrzeugen gegen Einflüsse von Temperatur, Feuchtigkeit oder Salz und erfüllt zudem dekorative Zwecke. Schichtdicke und mechanische Eigenschaften des Fahrzeuglacks sind entscheidend für die Funktion.
Automotive lacquer finishes protect vehicle bodywork against the effects of, for example, temperature, moisture or salt while also meeting decorative requirements. Coating thicknesses and the mechanical properties of the finish are decisive for their function. FISCHER offers a variety of measurement devices for the quality control of lacquer finishes, allowing you, for example, to determine the surface hardness and scratch resistance with certainty.
Les finitions de vernis automobile protègent la carrosserie du véhicule contre les effets de la température, de l'humidité ou du sel par exemple, tout en satisfaisant à des exigences esthétiques. Les épaisseurs de revêtement et les propriétés mécaniques de la finition sont décisives pour leur fonction. FISCHER fournit divers appareils de mesure pour le contrôle qualité des finitions de vernis, vous permettant, par exemple, de déterminer la dureté de surface et la résistance aux rayures avec certitude.
Los acabados de laca en los vehículos protegen la carrocería del vehículo contra los efectos de, por ejemplo, la temperatura, la humedad o la sal, a la vez que cumplen unos requisitos de decoración. El grosor de recubrimiento y las propiedades mecánicas del acabado son decisivas para su funcionamiento. FISCHER ofrece una variedad de equipos de medición para el control de calidad de los acabados de laca, lo que le permitirá, por ejemplo, determinar la dureza superficial y la resistencia contra arañazos con total certeza.
Le finiture di vernice alla cellulosa specifiche per il settore automobilistico proteggono la carrozzeria dei veicoli dagli effetti per esempio della temperatura, dell'umidità e del sale, soddisfacendo al contempo i requisiti decorativi posti. Gli spessori di rivestimento e le proprietà meccaniche della finitura sono essenziali per la sua funzionalità. FISCHER offre un'ampia gamma di apparecchi di misura per il controllo qualità di finiture in vernice di cellulosa, consentendo per esempio di determinare con certezza la durezza superficiale e la resistenza alla graffiatura.
Autolakken beschermen de carrosserie tegen de gevolgen van bijvoorbeeld temperatuur, vocht of zout, terwijl ze ook een decoratieve functie hebben. Laagdiktes en de mechanische eigenschappen van de laklaag zijn doorslaggevend voor hun functie. FISCHER biedt vele verschillende meetinstrumenten voor de kwaliteitscontrole van laklagen, waardoor u bijvoorbeeld de oppervlaktehardheid en krasbestendigheid met zekerheid kunt bepalen.
Autotööstuse lakkviimistlus kaitseb sõiduki kere näiteks temperatuuri, niiskuse või soola mõjude vastu, vastates samal ajal ka dekoratiivsetele nõuetele. Pinnakatete paksused ja viimistluse mehaanilised omadused on nende funktsioonide jaoks määrava tähtsusega. FISCHER pakub lakkide viimistluskvaliteedi kontrollimiseks erinevaid mõõteseadmeid, mis võimaldavad näiteks kahtlusteta kindlaks määrata pinna kõvaduse ja kriimustuskindluse.
Automobiliams skirtos lako dangos apsaugo transporto priemonės korpusą nuo kenksmingo temperatūros, drėgmės ir druskų poveikio. Šios dangos taip pat turi atitikti dekoratyvinėms dangoms keliamus reikalavimus. Dangų storis ir mechaninės savybės priklauso nuo jų paskirties. „FISCHER“ siūlo įvairius matavimo prietaisus, kuriais galima atlikti lako dangų kokybės kontrolę, pavyzdžiui, tiksliai nustatyti paviršiaus kietumą ir atsparumą įbrėžimams.
Lakier samochodowy chroni karoserię przed oddziaływaniem czynników takich jak temperatura, wilgotność i sól. Jednocześnie pełni funkcję dekoracyjną. O skuteczności powłoki decyduje jej grubość i właściwości mechaniczne. W ofercie firmy FISCHER znajdują się różne przyrządy pomiarowe do kontroli jakości lakieru. Dzięki nim można na przykład rzetelnie określić twardość powierzchni i jej odporność na zarysowania.
Лакокрасочное покрытие автомобиля защищает кузов автомобиля от воздействия температуры, влаги или соли, а также выполняет декоративную роль. С точки зрения этих функций толщина покрытия и механические свойства финишного покрытия являются решающими факторами. FISCHER предлагает множество измерительных приборов для контроля качества лакокрасочных финишных покрытий, которые позволяют с высокой точностью определять твердость и стойкость поверхности к образованию царапин.
Otomotiv lake kaplamaları dekoratif ihtiyaçları karşılarken taşıtın kaportasını da sıcaklık, nem veya tuz gibi etkilere karşı korur. Kaplamanın kalınlıkları ve mekanik özellikleri onların işlevini belirler. FISCHER, lake kaplamaların kalite kontrolü için çeşitli ölçüm cihazları sunarak size yüzey sertliğini ve çizilme direncini tam olarak belirlemek gibi avantajlar sağlar.
Automotive lacquer finishes protect vehicle bodywork against the effects of, for example, temperature, moisture or salt while also meeting decorative requirements. Coating thicknesses and the mechanical properties of the finish are decisive for their function. FISCHER offers a variety of measurement devices for the quality control of lacquer finishes, allowing you, for example, to determine the surface hardness and scratch resistance with certainty.
  Industrielle Messtechni...  
Sofort nach dem Abscheiden der Zinnschicht setzt die Diffusion des Kupfers in die Zinnschicht ein. Es bilden sich Zonen aus intermetallischen Verbindungen, die auf Kosten der restlichen Zinnmenge in Abhängigkeit von Temperatur und Zeit wachsen.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
Diffusion of copper into the tin starts immediately after deposition of the tin coating. Depending on temperature and time, intermetallic compounds can form which consume the tin in the plating until there is insufficient pure tin left to produce good solder joints. The loss of pure tin is further exacerbated by the heat of the solder process itself. For proper solder joints, a minimum thickness of 0.3 µm pure tin is required before the last solder procedure, meaning an initial layer of freshly deposited tin of at least 1-1.4 µm.
  Industrielle Messtechni...  
Die Qualität der Verdichtung ist von verschiedenen Faktoren wie der Güte der Oxidschicht, der Verdichtungszeit, Temperatur des Verdichtungsbades, pH-Wert der Verdichtungslösung etc. abhängig und kann mit Hilfe des Scheinleitwerts zerstörungsfrei überprüft werden.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.
Although the ultimate quality of the sealing depends on a variety of factors including the condition of the oxide layer, the hydration time, the sealing bath temperature, the pH value of the solution, etc., it can be examined simply and non-destructively by measuring the electrical admittance (Y). Using FISCHER’s handheld ANOTEST® YMP30-S instrument, the coating’s admittance can be determined in situ according to standards such as DIN EN ISO12373-5 and ASTM B 457-67. An electronic reference is also available for cross-verification of the instrument.